Maskless solder ball-equipped machine "Solder Bouncer"
Device equipped with solder balls using vibration technology! Capable of mounting balls as small as φ80μm! For research and development, and small quantity sample production!
The "Solder Bouncer," a maskless solder ball mounting machine, utilizes vibration technology and is capable of mounting balls as small as φ80μm. It is suitable for research and development as well as small-scale sample production. 【Features】 ■ Takes up less space compared to printing machines ■ No need for regular mask replacement due to its maskless design ■ Utilizes steady-state wave vibration for solder ball launching *For more details, please contact us or refer to the PDF data.
- Company：マイクロ・テック
- Price：Other
